New perspectives in wood bonding" symposium
27.09.2018
The Bern University of Applied Sciences Architecture, Wood and Construction in Biel is organizing a symposium at the end of October. Experts from companies and from research will present innovative applications as well as the latest developments in wood bonding. This year, the event will also address the topic of adhesives for wood-based panel production. TS3 will present its new technology.
On October 31, 2018, the symposium "New perspectives in wood bonding" will be held for the second time in Biel. This year, the event will also address the topic of adhesives for wood-based materials production. For this purpose, the Bern University of Applied Sciences (BFH) was able to win Dr. Manfred Dunky, a profound expert on bio-based adhesives, as a speaker. The conference will also deal with new and innovative bonding methods, such as the Timber Structures 3.0 technology from TS3. The conference is the most important Swiss platform for all players in the wood industry who deal with the topic of bonding and want to exchange information about innovations and trends.